SMT stands for surface mount technology and allows for electronics components to be installed and welded to printed circuit boards or PCBs. The process is summarized as follows:
Firstly, we align the PCB template on the surface of the board, and use the scraper to paste the solder paste on the surface of the template, ensuring that the coating is uniform and the quantity of the solder paste is controllable.
Secondly, we use pick up machines or hands to install components on the printed circuit boards of their respective locations. The wet solder paste coated before will be used as temporary adhesive, but we also prevent misalignment of PCB.
Then, through the reflow oven, circuit boards are subjected to infrared radiation, melting the solder paste and forming solder joints.
Finally, these boards are checked in the AOI machine or automatic optics inspection machine, this machine can intuitively carry out many quality checks on the circuit board, such as element alignment and solder bridge inspection. The circuit board is then further tested.
SMD is the abbreviation of surface mounting device, it is the device that is assembled by SMT component and technology. In the early stage, SMD is manually welded. Then, the first batch of pickup machines can only process several simple components. More complex and smaller components still needs to be manually placed.