Nintendo is a world famous entertainment equipment manufacturer, selling millions of consumer electronics over the years. They have high requirements for SMT patches and DIP plug-ins.
In 2011, after judging many other companies, Nintendo chose us to help them produce some of their electronics components. We produced many types of products with them as we were familiar with the structure of their game components. The partnership resulted in a zero loss management for these components.
Each year we accept an audit from this customer to ensure our services are performed appropriately.
SMT engineering capacity:
Minimum substrate size: 50mm*50mm
Maximum substrate size: 510mm*460mm
Minimum size of parts: 01005
Min Pitch-QFP (quad flat package):0.2mm
Min Pitch-BGA (ball grid array packaging):0.1mm
SMT production capacity:
About 24 million points / day
About 620 million points / month
SMT pass rate:
The qualified rate is above 99.5%
surface-mount device, SMT assembly service, electronics assembly